2CRSi is responsible for the design and the prototyping of an OCP-compliant server. The server will integrate SiPearl processor modules, EXAPSYS accelerators, and HIGHER-developed management modules (DC-SCM), alongside off-the-shelf commercial components. By integrating multiple components based on open Modular Hardware System (DC-MHS) specifications and designs from OCP, the resulting server will enable a modular and flexible architecture for easy configuration across cloud and edge deployments.
The DC-MHS server will be designed, optimised and prototyped around a common 19” chassis with a 2U height and 820mm depth, supporting multiple blade types:
- Allowing for various options and architectures
- Compatible with OCP M-SDNO Class A, B and C Form Factors
- Possibly updated to be OCP ORv3 compatible
- Air-cooled and possibly direct liquid-cooled
- With an adaptation kit from 19” to 21”
2CRSi will then assemble and power up the prototype server and carry out functional verification within the project scope.
Figure 1 shows an example of a potential 2U2N server architecture with:
- Interconnection between 2 motherboards SDNO Class A (Rhea2 SiPearl / x86 CPU), or interconnection between 1 motherboard (Rhea2 SiPearl / x86 CPU) and UBB 2xOAM EXAPSYS
- Options for storage and PCIe boards
- DC-SCM and OCP NIC 3
Figure 1: Potential 2U2N server architecture
Indeed, one chassis may be available in two configurations (2U2N or 2U4N), accommodating blades of different form factors. However, every blade will be able to integrate both M-SDNO Class A motherboards or the HIGHER OAM carrier board.